Eccentricity-resistant process design and finite element analysis of deep hole cylindrical parts

Eccentricity-resistant process design and finite element analysis of deep hole cylindrical parts

LI Shuo, ZHAI Yuewen, HE Xiaomao, QIN Sixiao, JIN Hong

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Abstract: In this paper, finite element analysis software was used to simulate and compare the deep-hole cylindrical parts formed by single process hot extrusion and double-process hot extrusion under the condition of uneven initial circumferential temperature of billet. The results show that the deformation resistance of the material is affected by the uneven temperature, and the strength of the single process hot extrusion parts is weakened because of the long punch length, which is easy to cause the eccentricity problem of the deep-hole cylindrical parts, and the wall thickness difference of the deep-hole cylindrical parts reaches 1.23 mm. The double-process hot extrusion can greatly reduce the influence of eccentricity on the deep hole cylindrical parts, make the wall thickness distribution more uniform, and the wall thickness difference is 0.38 mm. At the same time, the double-process hot extrusion reduces the forming force by 900 T and improves the feasibility of the process.

Keywords
Deep Hole Cylindrical Parts, Double-Process Hot Extrusion, Extrusion Off-Center

Published online 9/15/2024, 8 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: LI Shuo, ZHAI Yuewen, HE Xiaomao, QIN Sixiao, JIN Hong, Eccentricity-resistant process design and finite element analysis of deep hole cylindrical parts, Materials Research Proceedings, Vol. 44, pp 589-596, 2024

DOI: https://doi.org/10.21741/9781644903254-63

The article was published as article 63 of the book Metal Forming 2024

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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