Inverse identification of heat source model parameters for laser-powder directed energy deposition of AISI H13 deposit on AISI H11 substrate
BERTRAND Johanna, ABBES Fazilay, BONNEFOY Hervé, FLAN Bruno, ABBES Boussad
download PDFAbstract. Numerical modeling and simulation are very useful tools for assessing the impact of process parameters and predicting optimized conditions in Laser Directed Energy Deposition (L-DED) processes. Heat source parameters have a great influence on the accuracy of numerical modeling for predicting temperature fields and residual stresses. This paper presents a coupled experimental-numerical procedure to determine the Goldak’s heat source model parameters. Graded single-clad tracks were printed with the laser beam power increased continuously at a constant powder feeding rate and scanning speed. Bead widths, heights, and penetration depths were measured at different locations along the deposited track and then used as experimental data for an inverse identification process using the FEA code ABAQUS and the optimizer iSIGHT. The obtained results show that the accuracy of the numerical model is increased with optimized parameters.
Keywords
Directed Energy Deposition, Numerical Modeling, Goldak Heat Source, Parameters Identification
Published online 4/24/2024, 10 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: BERTRAND Johanna, ABBES Fazilay, BONNEFOY Hervé, FLAN Bruno, ABBES Boussad, Inverse identification of heat source model parameters for laser-powder directed energy deposition of AISI H13 deposit on AISI H11 substrate, Materials Research Proceedings, Vol. 41, pp 32-39, 2024
DOI: https://doi.org/10.21741/9781644903131-4
The article was published as article 4 of the book Material Forming
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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