Wear behavior and microhardness of some W/Cu functionally graded materials obtained by spark plasma sintering
Claudiu NICOLICESCU, Victor Horia NICOARĂ, Florin POPA, Traian Florin MARINCA
download PDFAbstract. This paper is focused on the elaboration of some W/Cu functionally graded materials (FGM) by spark plasma sintering (SPS) process, as well as on their characterization, from the wear behavior and microhardness point of view function of composition and sintering temperature. The raw materials used for the research were W/Cu mechanically alloyed powders for 20 hours, which were subjected to consolidation in three layers of compositions W100-xCux, where x is 25, 30 and 40 % wt. by SPS. The evolution of tribological parameters and microhardness function of the chemical composition and SPS temperature were investigated. Microhardness is influenced by the SPS temperature and composition of the layers namely, the highest value was attained for the sample sintered at 950 oC and layer 1 which consists in W75Cu25. The wear behavior is influenced by the composition of the layers and by ball testing material (100Cr6 and alumina).
Keywords
Functionally graded materials, Spark plasma sintering, Wear rate, Friction coefficient, Microhardness, Scanning electron microscopy, Optical microscopy
Published online 11/5/2018, 10 pages
Copyright © 2018 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: Claudiu NICOLICESCU, Victor Horia NICOARĂ, Florin POPA, Traian Florin MARINCA, ‘Wear behavior and microhardness of some W/Cu functionally graded materials obtained by spark plasma sintering’, Materials Research Proceedings, Vol. 8, pp 182-191, 2018
DOI: https://dx.doi.org/10.21741/9781945291999-21
The article was published as article 21 of the book Powder Metallurgy and Advanced Materials
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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