Stress Evaluation of Adhesively Bonded Lap Joints with Aluminum 2024-T3 Adherents Using FEA
M. Khodja, A. Ahmed, F. Hamida, G. Corderley, S. Govender
download PDFThe objective of this study is to develop a numerical approach which will lead to a method to aid in the design of bonded assemblies. An AA2024-T3 aluminum alloy was used as adherent for this study with Adekit-140 as the adhesive. The overlapping surfaces of the adherent and the adhesive were modelled with 3D models that were based on surface-to-surface contact elements. Analyses were performed where the length and the thickness of overlap were fixed, keeping the bonding area the same for all geometries. Peel stresses developing at the edges of the overlap area of the adhesively bonded single lap joints subjected to static tensile loading have a profound effect on the damage of the joint. The reduction in the stress values formed at the edges of the overlap area or the transfer of these stresses to the middle part of the overlap area increase the strength of the joint. It was noted that there is symmetry in the stress distribution about the middle of adhesive joint layer according to the length of overlap region. The maximum stresses were at the edge of the bond. Observations have been made on peel and shear stresses in the adhesive layer.
Keywords
Adhesive Bonded Joints, Finite Element Analysis (FEA), Simple-Lap Joint (SLJ), Single Step-Lap Joints (SSLJ), Shear Stresses, Peel Stresses, Von Mises Stresses
Published online 4/20/2018, 6 pages
Copyright © 2018 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: M. Khodja, A. Ahmed, F. Hamida, G. Corderley, S. Govender, ‘Stress Evaluation of Adhesively Bonded Lap Joints with Aluminum 2024-T3 Adherents Using FEA’, Materials Research Proceedings, Vol. 4, pp 23-28, 2018
DOI: https://dx.doi.org/10.21741/9781945291678-4
The article was published as article 4 of the book
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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