Metaheuristic approaches for solving the scheduling problem in the semiconductor diffusion work area

Metaheuristic approaches for solving the scheduling problem in the semiconductor diffusion work area

Roberto Rosario CORSINI, Antonio COSTA, Valeria FICHERA, Giuseppe ORITI, Daniele PAGANO

Abstract. Motivated by a real case study of a semiconductor company, the paper addresses the scheduling problem in the diffusion area, which is recognized as one of the most critical stages in semiconductor manufacturing. This work area can be modeled as a two-stage hybrid flow shop scheduling problem with re-entrant flows. The first stage is the cleaning process, wherein impurities are removed from the wafer surface. The second one entails several tasks, such as diffusion, deposition and oxidation, to be performed into different furnaces. Based on the product recipe, wafer lots may undergo multiple operations in the second stage. The diffusion area also includes several production constraints, such as p-batching, machine eligibility and Q-time constraint, which increase the complexity of the problem. A novel metaheuristic named the Modified Harmony Search algorithm is proposed to minimize the average flow time of the system.

Keywords
Scheduling, Semiconductor Manufacturing, Smart Manufacturing

Published online 9/10/2025, 9 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Roberto Rosario CORSINI, Antonio COSTA, Valeria FICHERA, Giuseppe ORITI, Daniele PAGANO, Metaheuristic approaches for solving the scheduling problem in the semiconductor diffusion work area, Materials Research Proceedings, Vol. 57, pp 521-529, 2025

DOI: https://doi.org/10.21741/9781644903735-61

The article was published as article 61 of the book Italian Manufacturing Association Conference

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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