In-situ monitoring of laser powder bed fusion on multi-material substrates for electric mobility

In-situ monitoring of laser powder bed fusion on multi-material substrates for electric mobility

Marco Grasso, Matteo Bugatti, Frank Sarfert, Aitor Echaniz, Bianca Maria Colosimo

Abstract. The growth of electromobility has driven the demand for advanced power electronics. Meeting the increasing functional requirements necessitates innovative manufacturing solutions. A promising approach involves combining traditional processes with additive manufacturing technologies. This paper focuses on a novel approach, which involves laser powder bed fusion (LPBF) to fabricate high-performance cooling structures directly on a Direct Bonded Copper (DBC) substrate made of a ceramic core sandwiched between two copper layers. This innovative method allows enhancing the cooling performance, but it introduces challenges, including residual stresses, substrate warpage, and ceramic layer cracking. To address these issues, this work presents a novel in-situ monitoring approach for LPBF of pure copper on multi-material substrates. By leveraging multi-sensor data fusion with efficient in-line processing, the proposed approach allows a fast detection of anomalies and defects.

Keywords
Additive Manufacturing, Electric Mobility, In-Situ Monitoring

Published online 9/10/2025, 8 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Marco Grasso, Matteo Bugatti, Frank Sarfert, Aitor Echaniz, Bianca Maria Colosimo, In-situ monitoring of laser powder bed fusion on multi-material substrates for electric mobility, Materials Research Proceedings, Vol. 57, pp 164-171, 2025

DOI: https://doi.org/10.21741/9781644903735-19

The article was published as article 19 of the book Italian Manufacturing Association Conference

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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