Effect of Silicon and Mechanical Alloying on Microstructure and Grain Evolution in CuAl and CuAlSi Alloys

Effect of Silicon and Mechanical Alloying on Microstructure and Grain Evolution in CuAl and CuAlSi Alloys

Nurlyana Izyan MOHD ALI, Nur Izzati MUHAMMAD NADZRI, Arif Anuar MUHD SALLEH, M.N.A. UDA, Sudha JOSEPH

Abstract. This research examines the influence of Si addition in CuAl alloy, and the effect of mechanical alloying on the microstructure and elemental distribution of CuAl and CuAlSi alloys, fabricated using powder metallurgy. SEM, micro-XRF, and EDX analyses were conducted to study morphological changes, compositional uniformity, and microstructural evolution. Mechanical alloying was found to introduce strain and defects, which, coupled with sintering, facilitated grain boundary movement and coarsening. Micro-XRF and EDX results showed improved elemental distribution in ball-milled and sintered samples compared to as-is alloys. In CuAlSi alloys, the equimolar composition supported uniform element distribution, though oxidation during sintering reduced the metallic Cu content. Sintering, especially following mechanical alloying, improved the microstructure by increasing grain compactness and refining elemental distribution. These modifications enhance the alloys’ mechanical properties, making them suitable for high-performance applications.

Keywords
Powder Metallurgy, Mechanical Alloying, Grain Coalescence

Published online 2025/06/01, 7 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Nurlyana Izyan MOHD ALI, Nur Izzati MUHAMMAD NADZRI, Arif Anuar MUHD SALLEH, M.N.A. UDA, Sudha JOSEPH, Effect of Silicon and Mechanical Alloying on Microstructure and Grain Evolution in CuAl and CuAlSi Alloys, Materials Research Proceedings, Vol. 56, pp 117-123, 2025

DOI: https://doi.org/10.21741/9781644903636-13

The article was published as article 13 of the book Composite Materials

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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