Lead-free solders for high-temperature applications
SATYANARAYAN, K. NARAYAN PRABHU
Abstract. Due to the toxicity of Pb, efforts to develop alternatives to Pb-based solders have been increased significantly. However, only a limited number of lead (Pb)-free solder systems exist for high-temperature applications. In the present paper, a review of the selection of Pb-free solder alloys for high-temperature (300°C–400°C) applications to replace traditional Pb-based alloys is carried out. A discussion on the research and development of high-temperature solder alloys is highlighted in the current review. The solder systems with alloying additions like Au, Sb, Ni and Zn must be investigated to be used as potential candidate materials for high-temperature applications
Keywords
Pb-Free Solders, Alloying, Wetting, High Temperature
Published online 6/1/2025, 5 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: SATYANARAYAN, K. NARAYAN PRABHU, Lead-free solders for high-temperature applications, Materials Research Proceedings, Vol. 55, pp 136-140, 2025
DOI: https://doi.org/10.21741/9781644903612-20
The article was published as article 20 of the book Materials Joining and Manufacturing Processes
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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