Exploring advanced micro-forming methods: Ultrasonic vibration (UV), pulsed current, and laser-assisted approaches
Mihiretu Ganta, Mahaboob Patel, Tewodros Dawit
Abstract. The demand for micro-forming processes has grown due to the increasing need for miniaturization in electronics, medical devices, aerospace, and automotive industries. However, materials with high strength, corrosion resistance, and low weight often lack adequate formability at ambient temperature. Notable examples include titanium alloys, magnesium alloys, and aluminum alloys. Advancements in manufacturing technologies have made micro-forming more viable and cost-effective, leading to a higher demand for smaller and more intricate components. Emerging techniques such as electrically assisted micro-forming, laser shock micro-forming, and ultrasonic vibration-assisted micro-forming have been devised to overcome limitations associated with conventional micro-forming processes, offering enhanced precision, versatility, improved formability, and superior cost-efficiency. This article presents a comprehensive overview of state-of-the-art methods for the aforementioned emerging processes. It identifies existing research gaps, highlights future directions, and examines contact-related challenges in micro/meso-forming processes.
Keywords
Electrically Assisted Forming (EAF), Laser Shock Forming, Micro Forming, Micro-Manufacturing, Ultrasonic Vibration Assisted (UVA) Micro Forming
Published online 6/1/2025, 10 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: Mihiretu Ganta, Mahaboob Patel, Tewodros Dawit, Exploring advanced micro-forming methods: Ultrasonic vibration (UV), pulsed current, and laser-assisted approaches, Materials Research Proceedings, Vol. 55, pp 85-94, 2025
DOI: https://doi.org/10.21741/9781644903612-14
The article was published as article 14 of the book Materials Joining and Manufacturing Processes
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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