Process-performance relationship of the CF/PA6 laminates

Process-performance relationship of the CF/PA6 laminates

Sepehr Simaafrookteh, Canbek Giray, Stepan V. Lomov, Jan Ivens

Abstract. The processing condition of the semi-crystalline thermoplastic composites can affect their mechanical performance. This study investigated the mechanical behavior of CF/PA6 thermoplastic tape processed into laminates at different conditions. A temperature range starting from the melting point of PA6 at 220 ºC to 260 ºC is investigated, together with a holding time of 5 to 30 seconds and two cooling approaches: water-cooled plates and cold plates The influence of processing conditions varied depending on the specific mechanical property being evaluated. Longitudinal tensile strength and modulus were found to be relatively insensitive to processing conditions. A slight increase for the higher cooling rate was obtained with the highest average tensile strength of 1180.2 ± 117.6 MPa. Peel strength was highest for laminates processed at higher temperatures (240 °C and 260 °C) and with cold plates for cooling, reaching a maximum of 3.9 ± 0.1 N/mm. These findings highlight the importance of optimizing processing conditions to balance thermal exposure and mechanical performance.

Keywords
CF/PA6, Thermoplastic, Peel Strength, Cooling Rate, Mechanical Properties

Published online 5/7/2025, 10 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Sepehr Simaafrookteh, Canbek Giray, Stepan V. Lomov, Jan Ivens, Process-performance relationship of the CF/PA6 laminates, Materials Research Proceedings, Vol. 54, pp 628-637, 2025

DOI: https://doi.org/10.21741/9781644903599-68

The article was published as article 68 of the book Material Forming

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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