Theoretical modelling of yield stress in cold-rolled and annealed AISI 420 steel: Dependence on rolling pre-strain
Yadong ZHOU, Kegu LU, Redmer VAN TIJUM, Yutao PEI, Jan POST
Abstract. With increasing demands for high-quality metal products, manufacturing processes have become more complex, generally involving both forming and heat treatment stages. During these stages, the developed flow stress after forming evolves throughout heat treatment, leading to residual stress redistribution, which can cause undesirable and unpredictable shape changes. To better understand the evolution of yield stress through these stages, uniaxial tensile tests were conducted on samples taken from cold-rolled and cold-rolled-and-annealed AISI 420 steel strips. Additionally, microstructural changes after annealing were characterized using electron backscattered diffraction (EBSD). The study examined various thickness reductions during cold rolling, while the annealing process was standardized to 760°C for 15 minutes. A two-step theoretical model was developed to correlate rolling pre-strain with the resulting yield stress after annealing, taking into account the combined effects of residual work hardening and the Hall-Petch relationship.
Keywords
Recovery, Recrystallization, Cold Rolling, Annealing, Yield Stress
Published online 5/7/2025, 9 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: Yadong ZHOU, Kegu LU, Redmer VAN TIJUM, Yutao PEI, Jan POST, Theoretical modelling of yield stress in cold-rolled and annealed AISI 420 steel: Dependence on rolling pre-strain, Materials Research Proceedings, Vol. 54, pp 1847-1855, 2025
DOI: https://doi.org/10.21741/9781644903599-198
The article was published as article 198 of the book Material Forming
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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