Transient dynamic analysis: Performance evaluation of tactile measurement
Gregor Reschke, Alexander Brosius
Abstract. The assessment of mechanically joined connections, such as clinched connections, is usually conducted destructively. Applicable non-destructive testing methods like computed tomography are time-consuming and costly, or, like electrical resistance measurement, provide only a limited amount of information. A fast, non-destructive evaluation of the joints condition shall be made possible by using transient dynamic analysis (TDA). It is based on the introduction of sound waves and the evaluation of the response behavior after passing through the structure. This study focuses the application of TDA to clinched shear connections to evaluate the performance of the tactile measuring setup. Twenty-one series were investigated, covering variations in joining task, manufacturing and defect. The evaluation was carried out using machine learning to determine for which series characteristic signals may be detected. It was shown that a classification of the investigated specimens is possible, whereby the classification accuracy depends on the examined variation. Furthermore, the accuracy was evaluated as a function of frequency and results were concluded to identify the limits of the used measuring setup.
Keywords
Joining, Machine Learning, Transient Dynamic Analysis
Published online 4/1/2025, 8 pages
Copyright © 2025 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: Gregor Reschke, Alexander Brosius, Transient dynamic analysis: Performance evaluation of tactile measurement, Materials Research Proceedings, Vol. 52, pp 293-300, 2025
DOI: https://doi.org/10.21741/9781644903551-36
The article was published as article 36 of the book Sheet Metal 2025
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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