Design of a device for cold plastic deformation processing using the ideas diagram method
BOCA Mihaia, GUEORGUIEV Tzvetelin, SLĂTINEANU Laurenţiu
Abstract. Among all the cutting processes, the turning process is the most widely spread process currently used in industry. Together with the machine tool, using the movements performed during work piece machining, the process could be adapted to achieve other processes techniques. An example of innovation has been proposed in this study. The authors emphasize a new perspective of using a lathe machine tool by its cutting tool, which after being used in the turning process can be used as a tool for performing a plastic deformation process. This fact will contribute to an increase in the hardness of the processed surface. The device obtained by using the ideas diagram method will enable its use to perform cold plastic deformation with the same cutting tool used in the turning process. The results, materialized by the obtained device, will allow the performance of all necessary movements to ensure the conditions that allow the implementation of the process and to obtain an increase of the surface hardness for a cylindrical work piece initially subjected to a turning process.
Keywords
Turning Process, Cold Plastic Deformation, Ideas Diagram Method, C-K Method
Published online 12/10/2024, 6 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: BOCA Mihaia, GUEORGUIEV Tzvetelin, SLĂTINEANU Laurenţiu, Design of a device for cold plastic deformation processing using the ideas diagram method, Materials Research Proceedings, Vol. 46, pp 129-134, 2024
DOI: https://doi.org/10.21741/9781644903377-17
The article was published as article 17 of the book Innovative Manufacturing Engineering and Energy
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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