Multi-sensor in process monitoring for WAAM: Detection of process instability in electrical signals

Multi-sensor in process monitoring for WAAM: Detection of process instability in electrical signals

OUESLATI Sarra, PAQUET Elodie, RITOU Mathieu, BELKADI Farouk, LE BOT Philippe

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Abstract. Wire Arc Additive Manufacturing (WAAM) is a promising process for producing medium to large scale metallic parts at a low cost and with a high deposition rate. However, the multitude of process parameters and physical phenomena involved makes it complex and hard to master. Therefore, monitoring the process becomes crucial for unraveling complexities and attaining a more profound comprehension of the intricacies inherent in WAAM, hence ensuring process stability. In order to produce a defect-free part, while keeping a stable process, the operating parameters must be carefully selected. Nonetheless, one of the significant hurdles in WAAM is the variability of the deposited layers height. The accumulation of these geometrical inaccuracies induces instabilities in the process which results into the appearing of defects on the deposited part. The aim of this study is to investigate the correlations between process instabilities and electrical signals obtained by a deposition monitoring system. A monitoring criterion is then extracted from experimental data. Correlation with instabilities will be confirmed using a thermal camera.

Keywords
WAAM, Monitoring, Additive Manufacturing, Smart Manufacturing

Published online 4/24/2024, 9 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: OUESLATI Sarra, PAQUET Elodie, RITOU Mathieu, BELKADI Farouk, LE BOT Philippe, Multi-sensor in process monitoring for WAAM: Detection of process instability in electrical signals, Materials Research Proceedings, Vol. 41, pp 371-379, 2024

DOI: https://doi.org/10.21741/9781644903131-42

The article was published as article 42 of the book Material Forming

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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