Prediction of the microstructure morphology after the WAAM process based on the FEM simulation results

Prediction of the microstructure morphology after the WAAM process based on the FEM simulation results

SZYNDLER Joanna, APEL Markus, HÄRTEL Sebastian

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Abstract. To improve understanding of the material behavior of additive-produced components, this paper focuses on the development of a numerical model that reproduces a Wire Arc Additive Manufacturing (WAAM) process, with particular attention given to the evolution of the microstructure. In this study, a finite element model in Simufact Welding software is developed, that replicates a real wire arc welding process of building a multilayer straight wall. Microscopy analysis of the weld wall cut in the middle of its length gave information about the expected microstructure morphology at different levels of the build wall. The whole experimental setup is reproduced in the software Simufact Welding. Simulation results in the form of temperature-time and temperature gradient-time history are then used as superimposed thermal conditions to simulate the microstructure evolution at different areas of the welded part by using MICRESS software.

Keywords
Finite Element Method (FEM), Wire Arc Additive Manufacturing (WAAM), Microstructure Prediction, Phase Field Method

Published online 4/24/2024, 10 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: SZYNDLER Joanna, APEL Markus, HÄRTEL Sebastian, Prediction of the microstructure morphology after the WAAM process based on the FEM simulation results, Materials Research Proceedings, Vol. 41, pp 22-31, 2024

DOI: https://doi.org/10.21741/9781644903131-3

The article was published as article 3 of the book Material Forming

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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