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Process analysis using adapted Rogowski coil for non-conventional processes
DARAWISH Haytham, HERZIG Mathias, SCHULZE Hans-Peter, KRÖNING Oliver
download PDFAbstract. The process analysis of non-conventional processes is very complex because many critical subprocesses can occur. These subprocesses can be determined among other things, by their positive and negative current increases. A process adapted Rogowski coil is particularly suitable for analyzing the current increases. Using the example of plasma electrolytic polishing, it will be shown how pulse typical effects can be distinguished from process typical effects. The boundary condition for this development was that the size of the measuring sensor had to be adapted to the system conditions of the plasma electrolytic polishing process. It was not necessary to calculate the real current, but rather to recognize the process situation very quickly. For this purpose, a higher signal amplification must be carried out during the polishing process and the initialization phase must be hidden. The example of experimental test setup shows, which analyzes can be carried out. The influence of the process disruption on the result can also be determined through comparisons with the processed final results.
Keywords
Rogowski Coil, Hybrid Processes, Process Analysis, Current Rise Time
Published online 4/24/2024, 9 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: DARAWISH Haytham, HERZIG Mathias, SCHULZE Hans-Peter, KRÖNING Oliver, Process analysis using adapted Rogowski coil for non-conventional processes, Materials Research Proceedings, Vol. 41, pp 2446-2454, 2024
DOI: https://doi.org/10.21741/9781644903131-269
The article was published as article 269 of the book Material Forming
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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