High strain rate investigation on the mechanical anisotropy induced by SLM technology on a 3D printed steel

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High strain rate investigation on the mechanical anisotropy induced by SLM technology on a 3D printed steel

MANCINI Edoardo, UTZERI Mattia, CORTIS Gabriele, SASSO Marco, CORTIS Daniele, ORLANDI Donato, CORTESE Luca, DI ANGELO Luca

Abstract. Selective Laser Melting (SLM) technology is an additive manufacturing (AM) technique that involves selective or localized melting of metallic powder bed by a high-intensity laser beam source. This technology is responsible for an induced anisotropy in the printed components: in fact, depending on the orientation of the part within the powder bed, different mechanical properties are usually obtained. It is also known that mechanical properties may depend on the rate of load application. This work studies the mechanical anisotropy induced by SLM technology on a 16MnCr5 case hardening steel subjected to high strain rate loading. A direct Split Hopkinson Bar was employed for testing. The Cowper-Symonds model was used to describe the material behavior at high strain rates for samples loaded in the building and in the normal to building directions.

Keywords
SLM, High Strain Rate, Material Anisotropy

Published online 4/24/2024, 6 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: MANCINI Edoardo, UTZERI Mattia, CORTIS Gabriele, SASSO Marco, CORTIS Daniele, ORLANDI Donato, CORTESE Luca, DI ANGELO Luca, High strain rate investigation on the mechanical anisotropy induced by SLM technology on a 3D printed steel, Materials Research Proceedings, Vol. 41, pp 2220-2225, 2024

DOI: https://doi.org/10.21741/9781644903131-244

The article was published as article 244 of the book Material Forming

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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