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Experimental testing and numerical modelling of ductile fracture of PEEK in incremental sheet forming process
GATEA Shakir, OU Hengan
download PDFAbstract. This research investigates the use of Hooputra-based damage model to predict fracture of polyether-ether-ketone (PEEK) material and its application to single point incremental forming (SPIF) process under different conditions. Flat PEEK sheets are used to examine the influence of temperature changes on the Hooputra fracture strain-stress triaxiality damage curve and to verify the capability of the Hooputra ductile damage model in predicting fracture in uniaxial tensile tests and the SPIF process. The research showed that the formulas used to calculate stress triaxiality based on geometric dimensions are insufficient with notched samples because the radius of the notched sample is no longer circular after plastic deformation. Temperature alters the Hooputra damage curve; therefore, the Hooputra ductile damage formula should be developed to consider the effect of temperature. When the Hooputra damage curve is established according to the temperature effect, the uniaxial fracture is precisely predicted at different temperatures. Hooputra ductile damage model could be developed to capture the fracture initiation and propagation in SPIF process.
Keywords
PEEK, Ductile Fracture, SPIF, Stress Triaxiality, Hooputra Damage Model
Published online 4/24/2024, 10 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: GATEA Shakir, OU Hengan, Experimental testing and numerical modelling of ductile fracture of PEEK in incremental sheet forming process, Materials Research Proceedings, Vol. 41, pp 1596-1605, 2024
DOI: https://doi.org/10.21741/9781644903131-177
The article was published as article 177 of the book Material Forming
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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