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A novel method to investigate tribological behaviors under transient temperatures using Pin-on-Cylinder tribometer and IR-thermography in glass forming
VU Anh Tuan, GRUNWALD Tim, BERGS Thomas
download PDFAbstract. In high-temperature material forming, achieving high precision demands a nuanced understanding of thermal and mechanical interactions at the contact interface. Conventional methods, often involving separate measurements of friction and heat transfer coefficients, encounter challenges as the growing number of influencing factors amplifies experimental complexity. This research introduces an innovative approach enabling the simultaneous determination of both coefficients in a single experimental run. A specially designed pin-on-cylinder tribometer enables the measurement of transient friction forces resulting from temperature variations at the interface, recorded by an infrared thermographic camera. Inverse methods are developed to derive the friction and heat transfer coefficients from the acquired transient force and temperature data. The method expedites the determination of contact coefficients, providing an efficient avenue for numerical and analytical studies in hot forming processes.
Keywords
Tribology, Friction, Contact Heat Transfer, Thermography, Glass Forming
Published online 4/24/2024, 10 pages
Copyright © 2024 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: VU Anh Tuan, GRUNWALD Tim, BERGS Thomas, A novel method to investigate tribological behaviors under transient temperatures using Pin-on-Cylinder tribometer and IR-thermography in glass forming, Materials Research Proceedings, Vol. 41, pp 1315-1324, 2024
DOI: https://doi.org/10.21741/9781644903131-146
The article was published as article 146 of the book Material Forming
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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