Workload and stress evaluation in advanced manufacturing systems

Workload and stress evaluation in advanced manufacturing systems

Graziana Blandino, Francesca Montagna, Marco Cantamessa

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Abstract. Industry 5.0 emphasizes the development of human-centred work environments, shifting the focus from technologies embedded in manufacturing systems to workers. Efforts in the literature focus on operators’ well-being for workstation configuration or on stress in collaborative environments, but few papers consider stress induced by management practices in advanced manufacturing contexts, although “lean” or “agile” for instance could in principle lead to more stressful workplaces. This paper reviews the literature, evaluating the mental and physical workload of production line operators who perform mentally demanding tasks and experience stress in advanced manufacturing systems. The goal is to design and to perform a pilot test on an innovative and rigorous research protocol, to be adopted in ‘non-fictional’ experiments, and able to compare push vs pull settings and their effects on workers’ workload and stress (WLS). The results will highlight new sources of stress, contributing to the development of human-centred and socially sustainable manufacturing systems.

Keywords
Ergonomics, Smart Manufacturing, Industry 4.0/5.0

Published online 9/5/2023, 9 pages
Copyright © 2023 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Graziana Blandino, Francesca Montagna, Marco Cantamessa, Workload and stress evaluation in advanced manufacturing systems, Materials Research Proceedings, Vol. 35, pp 53-61, 2023

DOI: https://doi.org/10.21741/9781644902714-7

The article was published as article 7 of the book Italian Manufacturing Association Conference

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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