Modelling the effect of tool material on material removal rate in electric discharge machining

Modelling the effect of tool material on material removal rate in electric discharge machining

Umair Arif, Imtiaz Ali Khan, Faisal Hasan

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Abstract. Present study aims at modelling the impact of tool materials such as copper, tungsten carbide and brass tool on the electric discharge machining of AISI 202 stainless steel. It is well known that the electrical conductivity of tool material has an influence on the current density passed through interelectrode gap and hence sparking process and MRR are affected accordingly. A finite element model was made using gaussian heat flux equation, spark radius and fraction of heat transferred to workpiece as a function of pulse on time and pulse current, latent heat in specific heat values and thermal conductivity properties. However, for the above reasons, current density used in gaussian heat flux equation was modified and electrical resistivity (which is inverse of electrical conductivity) of tool and workpiece were incorporated in it. This theorized heat flux formulae were then tested with the literature and found to give MRR similar to the literature.

Keywords
Thermal Model, Electric Discharge Machining, Tool Material, Gaussian Heat Flux

Published online 8/10/2023, 8 pages
Copyright © 2023 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA

Citation: Umair Arif, Imtiaz Ali Khan, Faisal Hasan, Modelling the effect of tool material on material removal rate in electric discharge machining, Materials Research Proceedings, Vol. 31, pp 448-455, 2023

DOI: https://doi.org/10.21741/9781644902592-46

The article was published as article 46 of the book Advanced Topics in Mechanics of Materials, Structures and Construction

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

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