Electron backscatter diffraction (EBSD) as a tool for analysis of metal flow in aluminum extrusion
PIRES Michael V., MADURA Jacek, MISIOLEK Wojciech Z., LEŚNIAK Dariusz, ZASADZIŃSKI Józef, JURCZAK Henryk
download PDFAbstract. Electron backscatter diffraction was used to analyze the crystallographic texture within extruded AA6005 hollow profiles, allowing for the analysis of metal flow through various extrusion porthole die designs of different metal deformation conditions. Control of metal flow through a die design is necessary to meet industry demands for faster-running dies, tighter tolerances, thinner walls, and reduced extrusion loads. A standard die was compared with an innovative die design that doubled the extrusion exit speed. Analysis of metal flow was performed to provide additional insight into the uniformity of the metal flow, especially near the extrusion welds. Finite element method simulations were performed to predict the die exit temperature and plastic strain distributions. Local texture varied across the core and surface regions of the tube wall but remained consistent between both extrudates. A peripheral coarse grain structure was found within both extrudates, due to their elevated exit die temperatures.
Keywords
EBSD Technique, Porthole Dies, Aluminum Extrusion
Published online 4/19/2023, 8 pages
Copyright © 2023 by the author(s)
Published under license by Materials Research Forum LLC., Millersville PA, USA
Citation: PIRES Michael V., MADURA Jacek, MISIOLEK Wojciech Z., LEŚNIAK Dariusz, ZASADZIŃSKI Józef, JURCZAK Henryk, Electron backscatter diffraction (EBSD) as a tool for analysis of metal flow in aluminum extrusion, Materials Research Proceedings, Vol. 28, pp 437-444, 2023
DOI: https://doi.org/10.21741/9781644902479-48
The article was published as article 48 of the book Material Forming
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
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